Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/179736
Kind Code:
A1
Abstract:
A semiconductor device according to the present disclosure is provided with: a circuit unit which comprises a heat sink layer, a wiring layer and a semiconductor element arranged between the heat sink layer and the wiring layer; a first flow channel member which is formed from an insulating material; and a second flow channel member which is formed from an insulating material. The circuit unit is positioned between the first flow channel member and the second flow channel member; and the wiring layer faces the first flow channel member or the second flow channel member.
Inventors:
MUNEISHI TAKESHI (JP)
Application Number:
PCT/JP2017/015404
Publication Date:
October 19, 2017
Filing Date:
April 14, 2017
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H05K7/20
Foreign References:
| JP2010097967A | 2010-04-30 | |||
| JP2013123014A | 2013-06-20 | |||
| JP2011200088A | 2011-10-06 |
Other References:
See also references of EP 3428964A4
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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