Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/199278
Kind Code:
A1
Abstract:
A semiconductor device 15 in which a semiconductor element 2 and a semiconductor element 3 are mounted on an interposer 1 on which fine wiring can be formed, wherein a first top surface part 2b and a third top surface part 3b on the boundary sides where the semiconductor element 2 and the semiconductor element 3 face each other have a second top surface part 2c and a fourth top surface part 3c, which are portions that are lower than the corresponding top surface parts. Furthermore, a resin member 6 is used as a filling material so that the second top surface part 2c and the fourth top surface part 3c in step parts 2e and 3e are covered when the gaps between parts 5 that connect the interposer 1 with the semiconductor element 2 and the semiconductor element 3 are filled with the resin member 6.
Inventors:
KATO MASAKO (JP)
MIYAMOTO SEIJI (JP)
MIYAMOTO SEIJI (JP)
Application Number:
PCT/JP2016/064439
Publication Date:
November 23, 2017
Filing Date:
May 16, 2016
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01L25/04; H01L21/60; H01L23/12; H01L23/29; H01L23/31; H01L25/18
Foreign References:
| JP2013222943A | 2013-10-28 | |||
| JP2006073843A | 2006-03-16 | |||
| US20130154062A1 | 2013-06-20 | |||
| JP2013539910A | 2013-10-28 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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