Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/217764
Kind Code:
A1
Abstract:
Disclosed in an embodiment is a semiconductor device comprising: a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.
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Inventors:
OH JUNG HUN (KR)
Application Number:
PCT/KR2017/006205
Publication Date:
December 21, 2017
Filing Date:
June 14, 2017
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L33/02; H01L33/14; H01L33/36; H01L33/38
Domestic Patent References:
| WO2013068878A1 | 2013-05-16 |
Foreign References:
| KR20130006810A | 2013-01-18 | |||
| KR20120131983A | 2012-12-05 | |||
| KR20110112999A | 2011-10-14 | |||
| KR20140100115A | 2014-08-14 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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