Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/011853
Kind Code:
A1
Abstract:
This semiconductor device (1) is provided with a plurality of semiconductor modules (3, 4) and a printed board (50) that extends across the plurality of semiconductor modules (3, 4). The plurality of semiconductor modules respectively comprise frames (30, 30p). The printed board (50) is fixed to the upper surfaces (32, 32p) of the frames (30, 30p) at a first fixation part (61), a second fixation part (62p) and a third fixation part (62). The third fixation part (62) is positioned between the first fixation part (61) and the second fixation part (62p). Consequently, this semiconductor device (1) is able to be suppressed in oscillation of the printed board (50), while being able to be reduced in size.
Inventors:
OMOTO YOHEI (JP)
Application Number:
PCT/JP2016/070420
Publication Date:
January 18, 2018
Filing Date:
July 11, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
| JP2006066572A | 2006-03-09 | |||
| JP2015130457A | 2015-07-16 | |||
| JPH06169578A | 1994-06-14 | |||
| JP2007242703A | 2007-09-20 | |||
| US6272015B1 | 2001-08-07 | |||
| JP2003501811A | 2003-01-14 | |||
| JP2011182626A | 2011-09-15 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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