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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/016162
Kind Code:
A1
Abstract:
This semiconductor device which accurately detects the temperature of a semiconductor element is provided with first and second substrates. The first and second substrates are facing each other by having a predetermined gap therebetween. A plurality of semiconductor elements are mounted on a first substrate surface facing the second substrate. A plurality of temperature detection elements are mounted on a second substrate surface facing the first substrate, and are thermally in contact with the semiconductor elements.

Inventors:
YUKAWA Junichi
Application Number:
JP2017/018437
Publication Date:
January 25, 2018
Filing Date:
May 17, 2017
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
H01L23/34; G01K1/14; G01K1/18; H01L23/40; H01L23/58; H01L25/00; H01L25/04; H01L25/07; H01L25/18; H02M7/48
Foreign References:
JPS5873145A1983-05-02
JP2013062277A2013-04-04
JP2007234753A2007-09-13
JP2005065224A2005-03-10
JPH10303582A1998-11-13
JP2002124618A2002-04-26
JP2014011385A2014-01-20
Attorney, Agent or Firm:
KAMATA Kenji et al. (1-61, Shiromi 2-chome, Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
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