Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/047913
Kind Code:
A1
Abstract:
A semiconductor device (1) is provided with: a semiconductor element (2); a support body (3) that is a metal member having as an outermost surface (35) a metallized layer (34) containing a first component that is an iron-group element, and a second component that is a periodic table group 5 or group 6 transition metal element other than chromium, the support body (3) being disposed so that the outermost surface faces the semiconductor element; a joining member (4) that is provided so as to be disposed between the outermost surface of the support body and the semiconductor element, the joining member (4) being joined to the outermost surface, whereby the semiconductor element is secured to the support body; and a molding resin (6) provided so as to cover the joined body (S) made from the support body, the joining member, and the semiconductor element.
Inventors:
IWASHIGE TOMOHITO (JP)
SUGIURA KAZUHIKO (JP)
MIWA KAZUHIRO (JP)
SAKUMA YUICHI (JP)
KUROSAKA SEIGO (JP)
ODA YUKINORI (JP)
SUGIURA KAZUHIKO (JP)
MIWA KAZUHIRO (JP)
SAKUMA YUICHI (JP)
KUROSAKA SEIGO (JP)
ODA YUKINORI (JP)
Application Number:
PCT/JP2017/032333
Publication Date:
March 15, 2018
Filing Date:
September 07, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
UEMURA KOGYO KK (JP)
UEMURA KOGYO KK (JP)
International Classes:
H01L23/48; H01L21/52
Foreign References:
| JPH04211153A | 1992-08-03 | |||
| JP2013038309A | 2013-02-21 | |||
| JP2003003292A | 2003-01-08 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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