Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/116974
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device which has high electromagnetic shielding properties, while exhibiting good heat dissipation properties. A semiconductor device according to the present invention is provided with: a semiconductor package 1 that is bonded on a circuit board 2; an electromagnetic wave absorbing layer 5 that covers surfaces of the semiconductor package 1 other than the surface bonded to the circuit board 2; and an electromagnetic wave reflecting layer 6 that covers the electromagnetic wave absorbing layer 5 from a side which is opposite to the semiconductor package 1 side. The electromagnetic wave absorbing layer 5 is configured from a resin that contains magnetic particles or carbon; and the electromagnetic wave reflecting layer 6 is configured from a resin that contains conductive particles.
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Inventors:
TANISHITA TOMOHIRO (JP)
HAMAGUCHI TSUNEO (JP)
ISHIDA KIYOSHI (JP)
HAMAGUCHI TSUNEO (JP)
ISHIDA KIYOSHI (JP)
Application Number:
PCT/JP2017/045069
Publication Date:
June 28, 2018
Filing Date:
December 15, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K9/00; H01L23/00; H01L23/29; H01L23/31; H05K7/20
Foreign References:
| JPH09116289A | 1997-05-02 | |||
| JP2002158484A | 2002-05-31 | |||
| JPH0831989A | 1996-02-02 | |||
| JP2013038162A | 2013-02-21 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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