Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/135104
Kind Code:
A1
Abstract:
Disclosed is a semiconductor device wherein a first semiconductor module (30) constitutes an upper arm, and has a plurality of semiconductor chips (301) connected to each other in parallel, a sealing resin body (300), and a positive electrode terminal (305). A second semiconductor module (40) constitutes a lower arm, and has a plurality of semiconductor chips (401) connected to each other in parallel, a sealing resin body (400), and a negative electrode terminal (406). In the X direction orthogonal to the Z direction, i.e., the laminating direction, the first and second semiconductor modules are disposed by being aligned with each other. The first semiconductor module and/or the second semiconductor module has a relay terminal (307, 408) that performs electrical relaying between the low potential-side electrode of the semiconductor chip (301) and the high potential-side electrode of the semiconductor chip (401).
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Inventors:
SUGITA SATORU (JP)
TANABE RYOTA (JP)
ARAI SHUNSUKE (JP)
TANABE RYOTA (JP)
ARAI SHUNSUKE (JP)
Application Number:
PCT/JP2017/040519
Publication Date:
July 26, 2018
Filing Date:
November 10, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/29; H01L25/18; H02M7/48
Domestic Patent References:
| WO2015001727A1 | 2015-01-08 | |||
| WO2010131679A1 | 2010-11-18 |
Foreign References:
| JP2009188346A | 2009-08-20 | |||
| JP2007035670A | 2007-02-08 | |||
| JP2015095560A | 2015-05-18 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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