Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/159018
Kind Code:
A1
Abstract:
Provided is a packaged semiconductor device which includes a die pad, a substrate having a drain terminal extending from the die pad in one direction in top view, and a gate terminal and source terminal provided extending in one direction to both sides of the drain terminal. The semiconductor device also includes a semiconductor chip that has a rectangular shape and that is disposed on the die pad such that the shorter sides of the semiconductor chip are parallel to the drain terminal and the centroid of the semiconductor chip is closer to the source terminal than the gate terminal. A gate pad is disposed on the gate terminal side of the top surface of the semiconductor chip. A plurality of source pads are also arranged from the source terminal side of the semiconductor chip toward the gate terminal side. The gate pad and the gate terminal are connected by a gate wire, and the plurality of source pads and the source terminal are connected by a plurality of source wires.
Inventors:
TSUNO TAKASHI (JP)
Application Number:
PCT/JP2017/039806
Publication Date:
September 07, 2018
Filing Date:
November 02, 2017
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/60; H01L25/07; H01L23/48; H01L25/18; H01L29/78
Foreign References:
| JP2005026294A | 2005-01-27 | |||
| US20060255362A1 | 2006-11-16 | |||
| US20110169144A1 | 2011-07-14 | |||
| US20050073012A1 | 2005-04-07 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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