Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179981
Kind Code:
A1
Abstract:
Proposed is a semiconductor device that enables the heat of a semiconductor chip to be more favorably dissipated. The proposed semiconductor device includes: a semiconductor chip comprising a semiconductor substrate and a surface electrode disposed on the surface of the semiconductor substrate; and a conductor plate which includes a plate-shaped part and a protruding part protruding from the plate-shaped part, and in which the end surface of the protruding part is connected to the surface electrode. The width of the end surface of the protruding part is narrower than the width of a base section, on the plate-shaped part side, of the protruding part.
Inventors:
KAWASHIMA TAKANORI (JP)
OHNO HIROTAKA (JP)
OHNO HIROTAKA (JP)
Application Number:
PCT/JP2018/005584
Publication Date:
October 04, 2018
Filing Date:
February 16, 2018
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
International Classes:
H01L23/50; H01L23/29
Foreign References:
| JP2013021254A | 2013-01-31 | |||
| JP3836010B2 | 2006-10-18 | |||
| US7838974B2 | 2010-11-23 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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