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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/186131
Kind Code:
A1
Abstract:
Provided is a semiconductor device that comprises: a semiconductor substrate (120) that has a front surface (120a) and a rear surface (120b) opposing the front surface in a plate thickness direction, and that includes an element formed thereon; a front surface electrode (121) soldered onto the front surface of the semiconductor substrate; a protective film (125) formed using a hygroscopic material; and a rear surface electrode (130) provided on the rear surface of the semiconductor substrate. The protective film includes: a peripheral section (126) provided so as to surround the front surface electrode on the front surface of the semiconductor substrate; a first separation section (127) extending in the row direction orthogonal to the plate thickness direction in a region surrounded by the peripheral section and dividing the front surface electrode in the column direction orthogonal to the plate thickness direction and row direction; and a second separation section (128) extending in the column direction in the region and dividing the front surface electrode in the row direction. The first separation section and the second separation section are provided in a separated manner from each other so as to avoid intersection.

Inventors:
OOSHIMA MASANORI (JP)
HAYASHI EIJI (JP)
Application Number:
PCT/JP2018/009849
Publication Date:
October 11, 2018
Filing Date:
March 14, 2018
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L23/00; H01L23/522; H01L23/532
Foreign References:
JP2011066377A2011-03-31
JP2005116962A2005-04-28
JP2000183108A2000-06-30
JPH03184396A1991-08-12
Attorney, Agent or Firm:
JIN Shunji (JP)
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