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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/194090
Kind Code:
A1
Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a mounting layer, a plurality of switching elements, a moisture-proof layer, and a sealing resin. The substrate has a main surface facing a thickness direction. The mounting layer has conductivity and is disposed on the main surface. Each of the plurality of switching elements has: an element main surface facing the side that the main surface faces in the thickness direction; a reverse surface facing the opposite side to the element main surface; and side surfaces connected to both the element main surface and the reverse surface. The plurality of switching elements are electrically connected to the mounting layer in a state in which the reverse surfaces thereof are opposed to the main surface. The moisture-proof layer covers at least one of the side surfaces. The sealing resin covers both the plurality of switching elements and the moisture-proof layer. The moisture-proof layer is in contact with both the mounting layer and the side surfaces so as to stride between the mounting layer and the side surfaces in the thickness direction.

Inventors:
HAYASHI KENJI (JP)
SUZAKI AKIHIRO (JP)
MATSUO MASAAKI (JP)
WATANABE RYUTA (JP)
IKENAGA MAKOTO (JP)
Application Number:
PCT/JP2018/015987
Publication Date:
October 25, 2018
Filing Date:
April 18, 2018
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/31; H01L25/18; H02M7/48
Domestic Patent References:
WO2013002249A12013-01-03
WO2016205929A12016-12-29
Foreign References:
JP2013183038A2013-09-12
JPS63143850A1988-06-16
JPH01261850A1989-10-18
JP2006165151A2006-06-22
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
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