Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/211735
Kind Code:
A1
Abstract:
The present invention enhances the precision of detecting degradation of a semiconductor device. A first metal pattern (51) and a second metal pattern (52) are connected to a control unit (100). A bonding wire (41) connects the first metal pattern (51) and an emitter electrode (31). A linear conductor (1a) connects a first electrode pad (311) and a second electrode pad (312). First bonding wires (411-414) connect the first electrode pad (311) and the second metal pattern (52). Second bonding wires (415-418) connect the second electrode pad (312) and the second metal pattern (52). When the difference in potential between the first metal pattern (51) and the second metal pattern (52) exceeds a threshold value, the control unit (100) detects degradation of a semiconductor element (1).
Inventors:
KAWAHARA CHIHIRO (JP)
HORIGUCHI TAKESHI (JP)
TAMADA YOSHIKO (JP)
NAKAYAMA YASUSHI (JP)
HORIGUCHI TAKESHI (JP)
TAMADA YOSHIKO (JP)
NAKAYAMA YASUSHI (JP)
Application Number:
PCT/JP2018/000012
Publication Date:
November 22, 2018
Filing Date:
January 04, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L21/336; H01L29/78
Domestic Patent References:
| WO2005038918A1 | 2005-04-28 |
Foreign References:
| JP2004342735A | 2004-12-02 | |||
| JPH09266226A | 1997-10-07 | |||
| JPH11111785A | 1999-04-23 | |||
| JP2008004728A | 2008-01-10 | |||
| JP2009295845A | 2009-12-17 | |||
| JP2015076442A | 2015-04-20 | |||
| JP2006047006A | 2006-02-16 | |||
| JP2014056968A | 2014-03-27 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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