Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/008828
Kind Code:
A1
Abstract:
Provided is a more compact, highly reliable semiconductor device. This semiconductor device (100) comprises an insulation substrate (41) having a main surface, a semiconductor element (2), a casing member (5), and a sealing resin (1) serving as a sealing material. The semiconductor element (2) is disposed above the main surface of the insulation substrate (41). The casing member (5) surrounds the semiconductor element (2) and is connected to the insulation substrate (41). The sealing resin (1) is disposed in an internal region surrounded by the casing member (5) and the insulation substrate (41), and surrounds the semiconductor element (2). The casing member (5) includes a recessed section (51) that faces the internal region and is connected to a connecting section connected to the insulation substrate (41). The recessed section (51) includes an opposing surface (61) serving as an inner wall section facing the main surface of the insulation substrate (41). The distance (H1) from the insulation substrate (41) main surface (first circuit substrate (31) upper surface) to the opposing surface (61) serving as the inner wall section is longer than the distance (H2) from the main surface to the upper surface (2a) of the semiconductor element (2).
Inventors:
KAJI YUSUKE (JP)
HARADA KOZO (JP)
HARADA KOZO (JP)
Application Number:
PCT/JP2018/008938
Publication Date:
January 10, 2019
Filing Date:
March 08, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L23/28; H01L25/18; H02M7/48
Domestic Patent References:
| WO2016121456A1 | 2016-08-04 |
Foreign References:
| JP2015046476A | 2015-03-12 | |||
| JP2015162649A | 2015-09-07 | |||
| JP2016058563A | 2016-04-21 | |||
| JP2013219267A | 2013-10-24 | |||
| JP2004214294A | 2004-07-29 | |||
| JPH08130291A | 1996-05-21 | |||
| JPH08162571A | 1996-06-21 | |||
| JPH0864759A | 1996-03-08 | |||
| JP2014203978A | 2014-10-27 | |||
| JP2016111028A | 2016-06-20 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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