Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/035413
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is mitigated. A semiconductor device 1 is molded by a mold resin layer 40 and comprises a semiconductor chip 20 and a substrate 10, the semiconductor device 1 being characterized by including, between the cured mold resin layer 40 and the substrate 10, a resin layer 50 which is different from the mold resin layer 40 and which has the thickness of 200 nm or less. It is preferable that the resin layer 50 present between the mold resin layer 40 and the substrate 10 be present at 30% or more of the circumference of the chip, where the total circumference of the chip is 100%.
Inventors:
MYODO HIROKI (JP)
HOTCHI TOYOKAZU (JP)
HOSHIYAMA MASAAKI (JP)
HOTCHI TOYOKAZU (JP)
HOSHIYAMA MASAAKI (JP)
Application Number:
PCT/JP2018/029949
Publication Date:
February 21, 2019
Filing Date:
August 09, 2018
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01L23/29; H01L23/31
Domestic Patent References:
| WO2014033768A1 | 2014-03-06 |
Foreign References:
| JP2012109636A | 2012-06-07 | |||
| JP2006032617A | 2006-02-02 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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