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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/102537
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element (10), a heat sink (50) on which the semiconductor element (10) is mounted, and a resin case (60) mounted on the heat sink (50) and accommodating the semiconductor element (10). Formed on the case (60) and the heat sink (50) are fastener holes (80) passing therethrough. The case (60) is provided with a plate-shaped surface pressure buffer member (61) having a higher rigidity than that of the resin, said plate-shaped surface pressure buffer member (61) being provided at the portions of the case (60) that include the fastener holes (80) in plan view.

Inventors:
IIZUKA ARATA (JP)
OKAMOTO KOREHIDE (JP)
Application Number:
PCT/JP2017/041950
Publication Date:
May 31, 2019
Filing Date:
November 22, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/40; H01L23/28; H01L25/07; H01L25/18; H05K5/02; H05K5/03; H05K7/20
Foreign References:
JP2012028552A2012-02-09
JP2013222870A2013-10-28
JP2017123360A2017-07-13
JP2003133756A2003-05-09
JP2010135548A2010-06-17
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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