SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2019/111755

A1

The purpose of the present invention is to provide a semiconductor device which cools an electronic component and a semiconductor module inside a housing. The semiconductor device is equipped with: a heat sink which includes a fin and a plate-shaped base part, has a semiconductor module provided on one surface of the base part, and has the fin provided on the other surface thereof; a housing which covers the one surface of the base part, the semiconductor module, an electronic component, and a circuit substrate, is attached to the base part, and houses the semiconductor module between the housing and the one surface of the base part; a fan for cooling the fin; and a first ventilation port and a second ventilation port which both connect the interior and exterior of the housing. The first ventilation port is provided above the height which is half the tallest height from the circuit substrate of the electronic component mounted to one surface of the circuit substrate inside the housing. The second ventilation port penetrates from the one surface to the other surface of the base part inside the housing. The first ventilation port and the second ventilation port form a ventilation channel inside the housing. The wind speed of the cooling wind on the one surface of the circuit substrate is slower than the wind speed of the cooling wind on the electronic component.

SATO MASAKI (JP)
SHIRAKATA YUJI (JP)
SUZUKI NORIHIRO (JP)
MURATA SHINJI (JP)

PCT/JP2018/043527

June 13, 2019

November 27, 2018

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MITSUBISHI ELECTRIC CORP (JP)

H01L23/467; H01L25/07; H01L25/18; H05K7/20

JPS62120398U	1987-07-30
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JP2011061201A	2011-03-24
JP2013093364A	2013-05-16
JPH10200282A	1998-07-31
JP2007043011A	2007-02-15

YOSHITAKE Hidetoshi et al. (JP)

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