Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/117107
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor device and is provided with a printed board, an electronic component, and a heat diffusing section. The printed board has: an insulating layer; first and second conductor layers disposed on first and second principal surfaces, respectively, of the insulating layer; a plurality of heat dissipating vias passing through from the first conductor layer to the second conductor layer on the insulating layer; and conductor films covering inner walls of the plurality of heat dissipating vias. The plurality of heat dissipating vias are provided at positions that overlap the heat diffusing section and the electronic component in plan view from the first principal surface side of the printed board. A heat dissipating section is disposed so as to overlap at least some of the plurality of heat dissipating vias in plan view from the second principal surface side of the printed board.
Inventors:
WAKAIKI SHUJI (JP)
SATO SHOTA (JP)
FUJII KENTA (JP)
KUMAGAI TAKASHI (JP)
SATO SHOTA (JP)
FUJII KENTA (JP)
KUMAGAI TAKASHI (JP)
Application Number:
PCT/JP2018/045379
Publication Date:
June 20, 2019
Filing Date:
December 11, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H01L23/40; H05K1/02; H05K7/20
Domestic Patent References:
| WO2017094670A1 | 2017-06-08 | |||
| WO2014020787A1 | 2014-02-06 |
Foreign References:
| JP2004006791A | 2004-01-08 | |||
| JPH03250794A | 1991-11-08 | |||
| JPH05326761A | 1993-12-10 | |||
| JPH0736468U | 1995-07-04 | |||
| JP2010245174A | 2010-10-28 | |||
| JP2017195236A | 2017-10-26 | |||
| JP2014138162A | 2014-07-28 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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