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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/135284
Kind Code:
A1
Abstract:
A flexible semiconductor chip (6) is soldered onto the top of a heat-dissipating material (4). The semiconductor chip (6) is pressed upon from above by the tip of a pressing member (9, 11). As a result, it is possible to suppress convex warping of the semiconductor chip (6). In addition, it is possible to prevent voids from remaining in the solder (7), and consequently, it is possible to improve the heat dissipation properties of the semiconductor device.

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Inventors:
OOGUSHI NAOHIRO (JP)
MURAI RYOJI (JP)
MURAKAMI TAKAHIKO (JP)
Application Number:
PCT/JP2018/000109
Publication Date:
July 11, 2019
Filing Date:
January 05, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48; H01L23/04
Domestic Patent References:
WO2016163237A12016-10-13
Foreign References:
JP2015088653A2015-05-07
JP2015050340A2015-03-16
JP2014204006A2014-10-27
JP2012191012A2012-10-04
JP2016122869A2016-07-07
JP2004253703A2004-09-09
JP2016051878A2016-04-11
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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