Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150825
Kind Code:
A1
Abstract:
This semiconductor device (1) comprises a mounting board (20), and a semiconductor element (10) disposed on the mounting board (20) via metal bumps (30). The semiconductor element (10) has a semiconductor layered structure (11) and a first electrode. The mounting board (20) has a second electrode. The metal bump (30) has a first layer (31) in contact with the first electrode of the semiconductor element (10), and a second layer (32) positioned on the side facing away from the first electrode. The mean crystal particle size of the crystals constituting the first layer (31) is greater than the mean crystal particle size of the crystals constituting the second layer (32). The second layer (32) is separated from the first electrode of the semiconductor element (10).
Inventors:
HIROKI MASANORI
HAYASHI SHIGEO
NAKASHIMA KENJI
FUKUHISA TOSHIYA
MASAMOTO KEIMEI
YAMADA ATSUSHI
HAYASHI SHIGEO
NAKASHIMA KENJI
FUKUHISA TOSHIYA
MASAMOTO KEIMEI
YAMADA ATSUSHI
Application Number:
PCT/JP2018/047041
Publication Date:
August 08, 2019
Filing Date:
December 20, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L21/60; B23K20/10; H01L21/607; H01L33/40; H01L33/62
Foreign References:
| US20150061115A1 | 2015-03-05 | |||
| JP2014154749A | 2014-08-25 | |||
| JP2002368271A | 2002-12-20 | |||
| JP2014232866A | 2014-12-11 | |||
| JP2017073520A | 2017-04-13 | |||
| JP2003273148A | 2003-09-26 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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