Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/150888
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor substrate; a first groove that is provided in the semiconductor substrate, has a first width W1, and extends in a first direction; and a second groove that is provided in the semiconductor substrate in communication with the first groove, has a second width W2 different from the first width, and extends in a second direction intersecting the first direction. Either the first groove or the second groove is used for alignment.
Inventors:
KANEGUCHI TOKIHISA (JP)
Application Number:
PCT/JP2019/000217
Publication Date:
August 08, 2019
Filing Date:
January 08, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L23/522; H01L27/146
Foreign References:
| JPH11340112A | 1999-12-10 | |||
| JP2000124107A | 2000-04-28 | |||
| US8674524B1 | 2014-03-18 | |||
| JP2005217071A | 2005-08-11 | |||
| JP2008135671A | 2008-06-12 | |||
| JP2012059832A | 2012-03-22 | |||
| JPH03119355A | 1991-05-21 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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