Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176380
Kind Code:
A1
Abstract:
With the present invention, it is possible to prevent a joining member from creeping up into a hollow hole of a contact part. A semiconductor device (10) has: a laminated substrate (14) comprising a circuit board (13a) and an insulating plate (11) on which the circuit board (13a) is formed; and a contact component (17) where a cylindrical hollow hole (17f) is formed in the interior, an open end part (17f2) being joined to a joining area (A2) of the front surface of the circuit board (13a) with a joining member (19) interposed therebetween. In such a semiconductor device (10), wettability relative to the joining member (19) is furthermore approximately equal in an area (A1) of contact of the contact component (17) with the joining member (19) and in at least the joining area (A2) of the circuit board (13a). For this reason, it is possible to suppress the joining member (19) from being caused to creep up into the hollow hole (17f) of the contact part (17) by the heating performed when the contact part (17) is being joined to the circuit board (13a).
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Inventors:
MARUYAMA RIKIHIRO (JP)
MIYAKOSHI MASAOKI (JP)
SOUTOME MASAYUKI (JP)
ADACHI KAZUYA (JP)
YOKOYAMA TAKESHI (JP)
MIYAKOSHI MASAOKI (JP)
SOUTOME MASAYUKI (JP)
ADACHI KAZUYA (JP)
YOKOYAMA TAKESHI (JP)
Application Number:
PCT/JP2019/004050
Publication Date:
September 19, 2019
Filing Date:
February 05, 2019
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01R4/02; B23K1/00; B23K1/20; H01L23/12; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2008090734A1 | 2008-07-31 | |||
| WO2014148319A1 | 2014-09-25 |
Foreign References:
| JP2007184315A | 2007-07-19 |
Attorney, Agent or Firm:
HATTORI, Kiyoshi (JP)
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