Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/193868
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor device which has excellent heat dissipation and an electromagnetic wave suppressing effect. In order to satisfy this purpose, this semiconductor device 1 is provided with: a semiconductor element 30 which is formed on a substrate 50; a conductive shield can 20 which has an opening 21; a conductive cooling member 40 which is provided above the conductive shield can 20; a heat conduction sheet 10 which is formed between the semiconductor element 30 and the conductive cooling member 40 at least through the opening 21; and a conductive member 11 which electrically connects the conductive shield can 20 and the conductive cooling member 40.
Inventors:
KUMURA TATSUO (JP)
Application Number:
PCT/JP2019/007113
Publication Date:
October 10, 2019
Filing Date:
February 25, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/00; H01L23/02; H01L23/04; H01L23/36
Foreign References:
| JP2006513556A | 2006-04-20 | |||
| JP2002184916A | 2002-06-28 | |||
| JP2016096249A | 2016-05-26 | |||
| JP2018107272A | 2018-07-05 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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