Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/193896
Kind Code:
A1
Abstract:
Provided is a semiconductor device characterized by comprising: a substrate including a circuit region and a peripheral region arranged so as to surround the circuit region in a plan view; a first wiring layer formed on the substrate; a second wiring layer formed on the first wiring layer; a third wiring layer formed on the second wiring layer; and a guard ring formed in the peripheral region, and characterized in that the guard ring includes: a first wiring that is formed in the first wiring layer to be arranged so as to surround the circuit region in a plan view; a second wiring that is formed in the third wiring layer to be arranged so as to surround the circuit region in a plan view; and a first via that is connected to the first wiring and the second wiring and arranged as a groove along the edges of the substrate in a plan view.
Inventors:
HARA AKIO (JP)
SAWADA TOYOJI (JP)
OKUNO MASAKI (JP)
OCHIMIZU HIROSATO (JP)
SAWADA TOYOJI (JP)
OKUNO MASAKI (JP)
OCHIMIZU HIROSATO (JP)
Application Number:
PCT/JP2019/008591
Publication Date:
October 10, 2019
Filing Date:
March 05, 2019
Export Citation:
Assignee:
SOCIONEXT INC (JP)
International Classes:
H01L21/768; H01L21/3205; H01L23/522
Foreign References:
US20090096104A1 | 2009-04-16 | |||
JP2008098605A | 2008-04-24 | |||
JP2006114723A | 2006-04-27 | |||
JP2008270232A | 2008-11-06 | |||
JP2005167198A | 2005-06-23 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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