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Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/202866
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising a semiconductor chip, a first current input/output unit that is electrically connected to the semiconductor chip, a second current input/output unit that is electrically connected to the semiconductor chip, three or more conducting parts on which the semiconductor chip is provided between the first current input/output unit and second current input/output unit, and a current path part having current paths that are electrically connected to the three or more conducting parts. The current path part includes a plurality of slits.

Inventors:
CHEN Shuangching (1-1, Tanabeshinden, Kawasaki-ku, Kawasaki-sh, Kanagawa 30, 〒2109530, JP)
YAMAMOTO Sayaka (1-1, Tanabeshinden, Kawasaki-ku, Kawasaki-sh, Kanagawa 30, 〒2109530, JP)
Application Number:
JP2019/009094
Publication Date:
October 24, 2019
Filing Date:
March 07, 2019
Export Citation:
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Assignee:
FUJI ELECTRIC CO., LTD. (1-1 Tanabeshinden, Kawasaki-ku Kawasaki-sh, Kanagawa 30, 〒2109530, JP)
International Classes:
H02M7/48; H01L25/07; H01L25/18; H02M7/483
Domestic Patent References:
WO2015121900A12015-08-20
Foreign References:
JP2014155287A2014-08-25
JP2015153839A2015-08-24
JP2009296727A2009-12-17
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (22F Shinjuku L Tower, 1-6-1 Nishi-Shinjuku, Shinjuku-k, Tokyo 22, 〒1631522, JP)
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