Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/202866
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising a semiconductor chip, a first current input/output unit that is electrically connected to the semiconductor chip, a second current input/output unit that is electrically connected to the semiconductor chip, three or more conducting parts on which the semiconductor chip is provided between the first current input/output unit and second current input/output unit, and a current path part having current paths that are electrically connected to the three or more conducting parts. The current path part includes a plurality of slits.
Inventors:
CHEN SHUANGCHING (JP)
YAMAMOTO SAYAKA (JP)
YAMAMOTO SAYAKA (JP)
Application Number:
PCT/JP2019/009094
Publication Date:
October 24, 2019
Filing Date:
March 07, 2019
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H02M7/48; H01L25/07; H01L25/18; H02M7/483
Domestic Patent References:
| WO2015121900A1 | 2015-08-20 |
Foreign References:
| JP2014155287A | 2014-08-25 | |||
| JP2015153839A | 2015-08-24 | |||
| JP2009296727A | 2009-12-17 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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