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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/207939
Kind Code:
A1
Abstract:
An embodiment of this disclosure is a configuration that is provided with a coupling element connected between a signal input circuit and signal output circuit and in which the signal input circuit, signal output circuit, and coupling element are packaged by being formed on a semiconductor chip. This configuration comprises an inspection output circuit for outputting an inspection signal from the signal input circuit to the outside without the signal passing through the coupling element and/or an inspection input circuit for inputting an inspection signal into the signal output circuit from the outside without the signal passing through the coupling element.

Inventors:
HASEGAWA, Junichi (1-1 Showa-cho, Kariya-cit, Aichi 61, 〒4488661, JP)
MICHISHITA, Yusuke (1-1 Showa-cho, Kariya-cit, Aichi 61, 〒4488661, JP)
Application Number:
JP2019/007053
Publication Date:
October 31, 2019
Filing Date:
February 25, 2019
Export Citation:
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Assignee:
DENSO CORPORATION (1-1 Showa-cho, Kariya-city Aichi, 61, 〒4488661, JP)
International Classes:
G01R31/28; H01L21/822; H01L27/04
Domestic Patent References:
WO2010119625A12010-10-21
WO2018020713A12018-02-01
Foreign References:
JP2017188903A2017-10-12
JP2010243218A2010-10-28
JP2003344508A2003-12-03
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (Fourteen Hills Center Building, 6-15 Sakae 4-chome, Naka-ku, Nagoya-sh, Aichi 08, 〒4600008, JP)
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