Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/211889
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce temperature difference in a refrigerant, between the upstream side and the downstream side of a flow path, even if all semiconductor elements generate heat as a result of inverter operation. This semiconductor device comprises at least one semiconductor element 1, a base plate 2, a plurality of cooling fans 2a, a jacket 5, and a partition wall 10. The jacket 5 is arranged on the lower surface of the base plate 2, surrounding the plurality of cooling fans 2a. The partition wall 10: is arranged on the lower side of the plurality of cooling fans 2a inside the jacket 5; causes refrigerant that has flowed in from a refrigerant inlet 5a to flow to the plurality of cooling fans 2a; and then causes the refrigerant to flow out to a refrigerant outlet 5b. The partition wall 10 also: comprises at least one inflow port 5c that causes refrigerant that has flowed in from the refrigerant inlet 5a to flow to the plurality of cooling fans 2a; and has a section that abuts the jacket 5 on the refrigerant inlet 5a side. At least one inflow port 5c is provided at a position corresponding to at least one semiconductor 1.
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Inventors:
USHIJIMA KOICHI (JP)
Application Number:
PCT/JP2018/017401
Publication Date:
November 07, 2019
Filing Date:
May 01, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/473; H05K7/20
Foreign References:
| JP2012129280A | 2012-07-05 | |||
| JP2017174991A | 2017-09-28 | |||
| JP2016149449A | 2016-08-18 | |||
| JP2014082311A | 2014-05-08 | |||
| JP2010098204A | 2010-04-30 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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