Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/235097
Kind Code:
A1
Abstract:
The present invention makes it possible to prevent internal abnormal overheating. The present invention includes circuit patterns (13a, 15a) that have conduction regions (13a1, 15a1) and wiring regions (13a3, 15a3) which communicate with the conduction regions (13a1, 15a1) via communication parts (13a2, 15a2). The present invention also includes circuit patterns (13b, 14b) that have conduction regions (13b1, 14b1) and wiring regions (13b3, 14b3) which communicate with the conduction regions (13b1, 14b1) via communication parts (13b2, 14b2) and which face the wiring regions (13a3, 15a3) with a predetermined distance therebetween. The present invention further includes wires that electrically connect the wiring regions (13a3, 15a3) to the wiring regions (13b3, 14b3). The communication parts (13a2, 15a2) and the communication parts (13b2, 14b2) are separated when seen from wiring directions (W1, W2) of the wires.
Inventors:
ISOZAKI MAKOTO (JP)
TAKAHASHI SEIICHI (JP)
TAKAHASHI SEIICHI (JP)
Application Number:
PCT/JP2019/017626
Publication Date:
December 12, 2019
Filing Date:
April 25, 2019
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L21/60
Foreign References:
| JP2011249394A | 2011-12-08 | |||
| JP2017135392A | 2017-08-03 | |||
| JP2017139406A | 2017-08-10 | |||
| JP2015167233A | 2015-09-24 |
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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