Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/003495
Kind Code:
A1
Abstract:
The purpose of the present invention is to ensure a uniform service life from semiconductor devices. A semiconductor device (101) is provided with a semiconductor element (1) having a front metal (11), a lead frame (2) having a first portion (21), a bonding layer (5) having a first layer (51) and a second layer (52), and a solder (31) thicker than the bonding layer. The material of the front metal and the material of the first portion are first metal and second metal, respectively. The first layer and the second layer are an alloy of the first metal and tin, and an alloy of the second metal and tin, respectively. The bonding layer is disposed between the first portion and the front metal. The first layer and the second layer are disposed on the front metal side and the first portion side, respectively. In the first portion, a plurality of holes passes while avoiding the outer contour of the front metal. The solder is disposed in the plurality of holes, and adjoins the bonding layer. The plurality of holes include a plurality of first holes (211) passing through the first portion in the thickness direction. The first holes are disposed in an annular region (213) inside the outer contour of the front metal.
Inventors:
KIMOTO NOBUYOSHI (JP)
AIKO MITSUNORI (JP)
SHIRASAWA TAKAAKI (JP)
AIKO MITSUNORI (JP)
SHIRASAWA TAKAAKI (JP)
Application Number:
PCT/JP2018/024821
Publication Date:
January 02, 2020
Filing Date:
June 29, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L23/48
Domestic Patent References:
| WO2017073233A1 | 2017-05-04 |
Foreign References:
| JP2009004435A | 2009-01-08 | |||
| JP2016167480A | 2016-09-15 | |||
| JP2008182074A | 2008-08-07 | |||
| JP2011204886A | 2011-10-13 | |||
| JP2012212713A | 2012-11-01 | |||
| JP2012235081A | 2012-11-29 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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