Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/045143
Kind Code:
A1
Abstract:
The present invention provides a semiconductor device having a structure that is suitable for high integration. This semiconductor device is provided with: a storage element; a first contact which is electrically connected to this storage element; a second contact which is positioned on the opposite side of the first contact in a first direction, and which is electrically connected to the storage element; a protective film which surrounds the storage element within a first plane that is perpendicular to the first direction; and a first hydrogen blocking layer which surrounds the protective film within the first plane.
Inventors:
FUKASAWA MASANAGA (JP)
SHIMIZU KAN (JP)
KIMURA TADAYUKI (JP)
SHIRAIWA TOSHIAKI (JP)
SHIMIZU KAN (JP)
KIMURA TADAYUKI (JP)
SHIRAIWA TOSHIAKI (JP)
Application Number:
PCT/JP2019/032267
Publication Date:
March 05, 2020
Filing Date:
August 19, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/8239; H01L21/3205; H01L21/768; H01L21/8234; H01L23/522; H01L23/532; H01L27/00; H01L27/088; H01L27/105; H01L27/146; H01L29/417; H01L29/82; H01L43/08
Foreign References:
| JP2014056941A | 2014-03-27 | |||
| JP2013021108A | 2013-01-31 | |||
| JP2007305645A | 2007-11-22 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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