Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/144814
Kind Code:
A1
Abstract:
Provided is a semiconductor device which suppresses damage of an insulating layer and suppresses degradation of the entire insulating viscous body that is formed between a conductor layer and a heat dissipating member. A semiconductor device 100 includes a semiconductor element 1, a wiring member 2, an insulating layer 3, a conductor layer 4, a heat dissipating member 5, and a sealing member 6. The conductor layer 4 and the insulating layer 3 are stacked in order from the surface on the heat dissipating member 5 side. An insulating viscous body 7 is formed between the conductor layer 4 and the heat dissipating member 5. A conductive projection 10, which is formed in a portion of a region of the insulating viscous body 7, protrudes from one of the conductor layer 4 and the heat dissipating member 5 toward the other but is separated from the other.
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Inventors:
HIRAKIDA KEN (JP)
ROKUBUICHI HODAKA (JP)
KITAI KIYOFUMI (JP)
ROKUBUICHI HODAKA (JP)
KITAI KIYOFUMI (JP)
Application Number:
PCT/JP2019/000528
Publication Date:
July 16, 2020
Filing Date:
January 10, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/28; H01L23/29; H01L23/36
Domestic Patent References:
| WO2017175612A1 | 2017-10-12 |
Foreign References:
| JP2008118067A | 2008-05-22 | |||
| JP2015153823A | 2015-08-24 | |||
| CN104882421A | 2015-09-02 | |||
| JP2015088556A | 2015-05-07 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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