Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179109
Kind Code:
A1
Abstract:
The present invention appropriately supplies electric power to a semiconductor module and suppresses the number of wiring layers of a main substrate on which the semiconductor module is mounted. A semiconductor device (10) is provided with a main substrate (90) and a semiconductor module (1). A first power supply circuit (71), the semiconductor module (1), and a first element (9) are mounted on the main substrate (90). The semiconductor module (1) is provided with second elements (2, 3), and a module substrate (4) on which the second elements (2, 3) are mounted. The first power supply circuit (71) supplies electric power (Vcc) to the first element (9). The semiconductor module (1) is further provided with a second power supply circuit (72) mounted on the module substrate (4), and the second power supply circuit (72) supplies electric power (Vcc) to the second elements (2, 3).
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Inventors:
NARUSE TAKANOBU (JP)
Application Number:
PCT/JP2019/035863
Publication Date:
September 10, 2020
Filing Date:
September 12, 2019
Export Citation:
Assignee:
AISIN AW CO (JP)
International Classes:
H01L25/00; H05K1/02
Domestic Patent References:
| WO2017038905A1 | 2017-03-09 |
Foreign References:
| JPH11186771A | 1999-07-09 | |||
| JP2002543513A | 2002-12-17 | |||
| JP2006049376A | 2006-02-16 | |||
| JP2013135160A | 2013-07-08 |
Other References:
See also references of EP 3937233A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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