Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179143
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising a semiconductor element, a sealing body which seals the semiconductor element, and a metal plate which is retained by the sealing body. The metal plate comprises an inner-side portion which is positioned within the sealing body and an outer-side portion which is positioned externally to the sealing body. An obverse surface of the metal plate comprises a non-roughened area and a roughened area which has a greater obverse surface roughness than the non-roughened area. The non-roughened area extends over both the inner-side portion and the outer-side portion of the metal plate.
Inventors:
HIRANO TAKAHIRO (JP)
MITSUNAGA TOMOAKI (JP)
SATOU KAISEI (JP)
OOSHIMA MASANORI (JP)
MITSUNAGA TOMOAKI (JP)
SATOU KAISEI (JP)
OOSHIMA MASANORI (JP)
Application Number:
PCT/JP2019/045292
Publication Date:
September 10, 2020
Filing Date:
November 19, 2019
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
DENSO CORP (JP)
DENSO CORP (JP)
International Classes:
H01L23/28; H01L23/29; H01L23/50
Foreign References:
| JP2018160653A | 2018-10-11 | |||
| JP2017208385A | 2017-11-24 | |||
| JP2016197706A | 2016-11-24 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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