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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/038824
Kind Code:
A1
Abstract:
A semiconductor device (1) is provided with a semiconductor-material substrate (11) forming a thin plate shape, a front-surface electrode (13) positioned on a front surface (11ff) of the substrate (11), a rear-surface electrode (17) covering a rear surface (11fr) of the substrate (11), and a via hole (1h) forming a hole shape that opens on the rear surface (11fr) side with the front-surface electrode (13) as a bottom and electrically connecting the front-surface electrode (13) and the rear-surface electrode (17), a protrusion (1p) protruding in the thickness direction being positioned on the periphery of the rear surface (11fr) side.

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Inventors:
KITANO TOSHIAKI (JP)
Application Number:
PCT/JP2019/034094
Publication Date:
March 04, 2021
Filing Date:
August 30, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/822; H01L21/52; H01L27/04
Foreign References:
JPH02257643A1990-10-18
JPH02140969A1990-05-30
JP2008085362A2008-04-10
JPH03211870A1991-09-17
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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