Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/070260
Kind Code:
A1
Abstract:
A semiconductor device disclosed in the present specification comprises: a semiconductor element; an encapsulant for sealing the semiconductor element; and a plurality of terminals which are electrically connected to the semiconductor element inside the encapsulant and protrude from the encapsulant, wherein each of the plurality of terminals has a rough surface area having a large surface roughness in a partial section in the longitudinal direction of the terminals.
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Inventors:
HIRANO TAKAHIRO (JP)
SUGIURA SHUN (JP)
OOSHIMA MASANORI (JP)
SUGIURA SHUN (JP)
OOSHIMA MASANORI (JP)
Application Number:
PCT/JP2019/039703
Publication Date:
April 15, 2021
Filing Date:
October 08, 2019
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
DENSO CORP (JP)
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/50; H01L25/18
Foreign References:
| JPH11260994A | 1999-09-24 | |||
| JP2004339584A | 2004-12-02 | |||
| JP2015041441A | 2015-03-02 | |||
| JPS6357752U | 1988-04-18 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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