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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/111604
Kind Code:
A1
Abstract:
Provided is a semiconductor device comprising: a first chip that has a substrate, and a first wiring layer formed on a first face of the substrate; and a second wiring layer formed on a second face on the side opposite to the first face of the substrate. The second wiring layer has a first power line to which a first power potential is supplied, a second power line to which a second power potential is supplied, a third power line to which a third power potential is supplied, a first switch that is connected between the first power line and the second power line, and a second switch that is provided on one of the first power line or the third power line. The first chip has a first circuit that is provided between the first power line and the third power line.

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Inventors:
OKAMOTO ATSUSHI (JP)
TAKENO HIROTAKA (JP)
WANG WENZHEN (JP)
Application Number:
PCT/JP2019/047688
Publication Date:
June 10, 2021
Filing Date:
December 05, 2019
Export Citation:
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Assignee:
SOCIONEXT INC (JP)
International Classes:
H01L27/04
Domestic Patent References:
WO2019194007A12019-10-10
Foreign References:
US20150187642A12015-07-02
JPH05206420A1993-08-13
JPH11102910A1999-04-13
JP2014165358A2014-09-08
JPS5326689A1978-03-11
JP2009302198A2009-12-24
JP2012044042A2012-03-01
JP2011159810A2011-08-18
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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