Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117627
Kind Code:
A1
Abstract:
This semiconductor device includes: a semiconductor chip which has a main surface; a device region which is partitioned off on the main surface; a differential amplifier which is formed in the device region and which amplifies and then outputs a differential signal that has been input; an insulating layer which is provided on the main surface so as to cover the device region; and a shielding electrode which is incorporated in the insulating layer so as to cover the device region in a view from above and which is fixed to the ground potential.
Inventors:
YOSHII YUSUKE (JP)
INOUE YUKI (JP)
MAKIMOTO HIROYUKI (JP)
INOUE YUKI (JP)
MAKIMOTO HIROYUKI (JP)
Application Number:
PCT/JP2020/045225
Publication Date:
June 17, 2021
Filing Date:
December 04, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L27/04; H03F3/45
Foreign References:
| JPH0555380A | 1993-03-05 | |||
| JPH06326529A | 1994-11-25 | |||
| JP2006025039A | 2006-01-26 | |||
| JP2003133421A | 2003-05-09 | |||
| JP2019102522A | 2019-06-24 | |||
| JP2008034676A | 2008-02-14 | |||
| JPH04179233A | 1992-06-25 | |||
| JPH04369226A | 1992-12-22 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
Download PDF: