Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/024567
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a semiconductor chip (30) having elements formed on a SiC substrate; a terminal (60) and heat sinks (40, 50) which are heat dissipation members disposed so as to sandwich the semiconductor chip (30); and solders (90, 91, 92) which are interposed between the semiconductor chip and the heat dissipation members and which form joining parts. The solders (90, 91) are lead-free solders having an alloy composition containing 3.2-3.8 mass% of Ag, 0.6-0.8 mass% of Cu, 0.01-0.2 mass% of Ni, Sb and Bi in amounts of x mass% and y mass%, respectively, so as to satisfy x+2y≤11 mass%, x+14y≤42 mass%, and x≥5.1 mass%, 0.001-0.3 mass% of Co, and 0.001-0.2 mass% of P, the remaining portion being Sn.
Inventors:
YAMAGISHI TETSUTO (JP)
SAKAMOTO YOSHITSUGU (JP)
KAIZU RYOICHI (JP)
INABA YUKI (JP)
YOSHIKAWA HIROKI (JP)
SAKAMOTO YOSHITSUGU (JP)
KAIZU RYOICHI (JP)
INABA YUKI (JP)
YOSHIKAWA HIROKI (JP)
Application Number:
PCT/JP2021/022462
Publication Date:
February 03, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
C22C13/02; B23K35/26; H01L21/52; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020079971A1 | 2020-04-23 |
Foreign References:
| JP2019520985A | 2019-07-25 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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