Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/024572
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with: a semiconductor chip which has an element-forming surface on which an element structure is formed; a first conductive layer which is formed on the element-forming surface of the semiconductor chip; a second conductive layer which is formed on the first conductive layer; a first wire which is connected to the second conductive layer and formed from a material including copper as a main component thereof; and a third conductive layer formed between the first conductive layer and the second conductive layer and which contains a material harder than copper.
Inventors:
YUTANI MASATSUGU (JP)
Application Number:
PCT/JP2021/022724
Publication Date:
February 03, 2022
Filing Date:
June 15, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Foreign References:
| JP2016115700A | 2016-06-23 | |||
| JP2018061018A | 2018-04-12 | |||
| JP2008258499A | 2008-10-23 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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