Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/153902
Kind Code:
A1
Abstract:
This semiconductor device is provided with: a semiconductor element; a plurality of first leads which are electrically connected to the semiconductor element; and a sealing resin which has a top surface and a bottom surface facing opposite sides in the thickness direction of the semiconductor element, while covering parts of the plurality of first leads and the semiconductor element. The sealing resin has an opening which extends from the top surface to the bottom surface. Each of the plurality of first leads has: a covered part which is covered by the sealing resin; and an exposed part which is continued to the covered part, while being exposed from the sealing resin. When viewed from the thickness direction, the exposed part of at least one of the plurality of first leads is contained in the opening.
Inventors:
KOGA AKIHIRO (JP)
Application Number:
PCT/JP2022/000123
Publication Date:
July 21, 2022
Filing Date:
January 05, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/28; H01L23/48
Domestic Patent References:
| WO2020050325A1 | 2020-03-12 |
Foreign References:
| JPH06163743A | 1994-06-10 | |||
| JPH09153569A | 1997-06-10 | |||
| JPH0446550U | 1992-04-21 | |||
| JPH02249981A | 1990-10-05 | |||
| JPH0444161U | 1992-04-15 | |||
| JPH11354703A | 1999-12-24 | |||
| JP2004165281A | 2004-06-10 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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