Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/168618
Kind Code:
A1
Abstract:
A semiconductor device that comprises: a substrate that has a principal surface that faces in the thickness direction; a first lead that is fixed on the principal surface and has a mounting surface that faces the same side in the thickness direction as the principal surface; and a first semiconductor element that is arranged on the mounting surface. The size of the substrate in a first direction that is orthogonal to the thickness direction is greater than the size of the substrate in a second direction that is orthogonal to the thickness direction and the first direction. The first lead includes: a first region that coincides with the first semiconductor element as seen in the thickness direction; and a second region that is separated from the first semiconductor element as seen in the thickness direction. At least a portion of the second region extends in the second direction, and the second region is thinner than the first region.
Inventors:
TAJIRI HIROYUKI (JP)
Application Number:
PCT/JP2022/001961
Publication Date:
August 11, 2022
Filing Date:
January 20, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| WO2020012957A1 | 2020-01-16 |
Foreign References:
| JP2014207430A | 2014-10-30 | |||
| JP2016072417A | 2016-05-09 | |||
| JP2002314030A | 2002-10-25 | |||
| JP2014216459A | 2014-11-17 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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