Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/196278
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, a first lead having a first part on which the semiconductor element is mounted, a second lead separated from the first lead and conductive with the semiconductor element, and a resin part covering one part each of the semiconductor element, the first lead, and the second lead. The first part has a first main surface and a first rear surface facing opposite sides to each other in a thickness direction. The semiconductor element has an element main surface and an element rear surface facing opposite sides to each other in the thickness direction. The element rear surface faces the first main surface. The resin part has a resin main surface and a resin rear surface facing opposite sides to each other in the thickness direction. The first rear surface is exposed from the resin rear surface, and the area ratio of the first rear surface to the area of a region surrounded by an outer peripheral edge of the resin rear surface is 40-50%.
Inventors:
ONO TSUNEHISA (JP)
Application Number:
PCT/JP2022/007573
Publication Date:
September 22, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/29; H01L23/50
Domestic Patent References:
| WO2020012958A1 | 2020-01-16 |
Foreign References:
| JP2018085480A | 2018-05-31 | |||
| JP2013247131A | 2013-12-09 | |||
| JP2003046051A | 2003-02-14 | |||
| JP2013118416A | 2013-06-13 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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