Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/249388
Kind Code:
A1
Abstract:
Provided is a semiconductor device (100) in which a plurality of cavity structures are formed in a matrix manner, in which a part of a rear surface conductor (5) exposed from a substrate (2) in each recess functions as a heat sink (5h) for mounting a semiconductor element (4) thereon, and which is a product integrally molded with a mold material (1) for sealing the front side of the substrate (2), wherein the rear surface conductor (5) is configured such that, in addition to the heat sink (5h), electrodes (5e) for electrical connection with the outside are formed so as to correspond to each of the plurality of cavity structures and such that a support part (6) is formed so as to be disposed at a position that is away from a dicing line (Ld) for individually separating each of the cavity structures and that is closer to the dicing line (Ld) than to the heat sink (5h) and the electrodes (5e) and so as to be interposed between a molding die (80) and the substrate (2) during integral molding with the mold material (1).
Inventors:
IWAI YUJI (JP)
KUMA TAKAHIRO (JP)
KUMA TAKAHIRO (JP)
Application Number:
PCT/JP2021/020165
Publication Date:
December 01, 2022
Filing Date:
May 27, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/29
Domestic Patent References:
| WO2020012598A1 | 2020-01-16 | |||
| WO2019198199A1 | 2019-10-17 |
Foreign References:
| JP2002118213A | 2002-04-19 | |||
| JPH07193168A | 1995-07-28 | |||
| JP2001110830A | 2001-04-20 |
Attorney, Agent or Firm:
PALMO PATENT FIRM, P.C. (JP)
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