Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/021938
Kind Code:
A1
Abstract:
This semiconductor device is provided with a semiconductor element, a conductive member which is electrically connected to the semiconductor element, and a sealing resin which covers the semiconductor element. The conductive member is provided with: a first lead that has a mounting part on which the semiconductor element is mounted, and a first terminal that is connected to the mounting part; and a second lead that has a second terminal. The first terminal and the second terminal respectively have portions that protrude from the sealing resin in the x direction. The sealing resin has a resin main surface and a resin back surface, which face opposite to each other in the z direction. In addition, the sealing resin is provided with a resin end face that is connected to the resin main surface and the resin back surface, while facing the direction in which the first terminal and the second terminal protrude. On the resin end face, the first terminal and the second terminal are at a distance from each other both in the y direction and in the z direction.
Inventors:
KITAGURO KOICHI (JP)
Application Number:
PCT/JP2022/028605
Publication Date:
February 23, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48
Foreign References:
| JPH04162654A | 1992-06-08 | |||
| JPH01135032A | 1989-05-26 | |||
| JPS59117160U | 1984-08-07 | |||
| JP2020074438A | 2020-05-14 | |||
| JPS5435168U | 1979-03-07 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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