Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/149107
Kind Code:
A1
Abstract:
The present specification pertains to a semiconductor device comprising a semiconductor element having a main electrode and a control electrode on a main surface thereof, and provides a technique for reducing the size of the control electrode. The semiconductor device disclosed in the present specification comprises: a semiconductor element having a main electrode and a control electrode on one main surface thereof; and a terminal substrate to which a wire is bonded. A bonding terminal is formed on the obverse surface of the terminal substrate. A relay terminal is formed on the reverse surface of the terminal substrate. The bonding terminal is electrically connected to the relay terminal. The terminal substrate is bonded to the semiconductor element such that the control electrode is in contact with the relay terminal. The area of the bonding terminal is larger than the area of the control electrode. In addition, the reverse surface of the terminal substrate is provided with a step. A side surface of an element substrate abuts the step. By providing the bonding terminal to which a wire is bonded, to a substrate (terminal substrate) different from the semiconductor element, the size of the control electrode can be reduced.
Inventors:
WATANABE MASAKAZU (JP)
Application Number:
PCT/JP2022/046879
Publication Date:
August 10, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/60; H01L23/12
Foreign References:
| JP2018056538A | 2018-04-05 | |||
| JP2009170645A | 2009-07-30 | |||
| JP2013073945A | 2013-04-22 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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