Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/166952
Kind Code:
A1
Abstract:
A semiconductor element is arranged on a substrate (50), the drain electrode being electrically connected to a superficial metal body (52). A single solid-phase-bonding bonding part (120) is formed between the superficial metal body (52) and a principal terminal (91). A plating film (130) is provided on the superficial metal body (52) and the principal terminal (91) so as to cover the bonding part (120). An overlap region (911) of the principal terminal (91) that overlaps the superficial metal body (52) includes a bonding region (912) that coincides with the bonding part and a non-bonding region (913) that is adjacent to the bonding region (912) in at least the width direction of the principal terminal (91). The principal terminal (91) is a wide terminal, the overlap region (911) being wider than the bonding part (120).
Inventors:
TSUCHIMOCIHI SHINGO (JP)
KAWASHIMA TAKANORI (JP)
KAWASHIMA TAKANORI (JP)
Application Number:
PCT/JP2023/004587
Publication Date:
September 07, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
| WO2016108261A1 | 2016-07-07 |
Foreign References:
| JP2010212645A | 2010-09-24 | |||
| JP2010010537A | 2010-01-14 | |||
| JP2021093503A | 2021-06-17 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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