Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/181991
Kind Code:
A1
Abstract:
This semiconductor device comprises: a first lead 1 that has a first surface facing one side in a thickness direction z; a semiconductor element supported on the first surface; and a conductive bonding material that bonds the first surface and the semiconductor element. The semiconductor element has an element back surface facing the opposite side in the thickness direction z, a back surface conductive layer disposed on the element back surface, and four element side surfaces. The semiconductor element has at least one recess portion that is connected to at least one of the four element side surfaces and to the element back surface, and that is recessed from the element side surface and the element back surface. The conductive bonding material includes a first portion disposed between the first surface and the back surface conductive layer, and a second portion that is connected to the first portion and is disposed between the first surface and the at least one recess portion.
Inventors:
FUJII TATSUYA (JP)
KONO HIROMASA (JP)
KASHIWAGI KENGO (JP)
KONO HIROMASA (JP)
KASHIWAGI KENGO (JP)
Application Number:
PCT/JP2023/009288
Publication Date:
September 28, 2023
Filing Date:
March 10, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/52; H01L21/48; H01L21/50
Foreign References:
| JP2020077665A | 2020-05-21 | |||
| JP2017135241A | 2017-08-03 | |||
| JP2016192476A | 2016-11-10 | |||
| JP2016157880A | 2016-09-01 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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