Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243271
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device that can protect a glass substrate and that is highly reliable even when a glass laminate substrate is used. [Solution] A semiconductor device according to an embodiment of the present invention comprises: a glass substrate having a first surface, a second surface on the side opposite to the first surface, and a first lateral surface located between the first surface and the second surface; a first frame-like material that has a third surface on the first surface side, a fourth surface on the second surface side, and a first inner surface facing the first lateral surface, and that is provided around the glass substrate; a first insulating film provided between the first lateral surface and the first inner surface and on the first and third surfaces; a first wiring layer provided on the first insulating film provided to the first and third surfaces; and a second insulating film provided on the first wiring layer.
Inventors:
ADACHI KIWAMU (JP)
MITARAI SHUN (JP)
IGARASHI TAKAHIRO (JP)
SEKI KOUSUKE (JP)
OKA SHUICHI (JP)
MITARAI SHUN (JP)
IGARASHI TAKAHIRO (JP)
SEKI KOUSUKE (JP)
OKA SHUICHI (JP)
Application Number:
PCT/JP2023/017783
Publication Date:
December 21, 2023
Filing Date:
May 11, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/15; H01L23/02; H01L23/12
Domestic Patent References:
| WO2021200406A1 | 2021-10-07 | |||
| WO2021200094A1 | 2021-10-07 |
Foreign References:
| JP2014093330A | 2014-05-19 | |||
| JP2016111244A | 2016-06-20 |
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
Download PDF: