Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/282013
Kind Code:
A1
Abstract:
This semiconductor device is configured so as to increase the energy that is able to be absorbed by an active clamp. This semiconductor device is provided with a semiconductor element, a sealing resin and a cover part. The semiconductor element comprises a first electrode. The sealing resin covers the semiconductor element. The cover part is arranged so as to intervene between the first electrode and the sealing resin. In addition, the cover part contains a material that has a higher thermal conductivity than the sealing resin.
Inventors:
OKUDA HAJIME (JP)
NISHIYAMA YUTO (JP)
TAKUMA TORU (JP)
NISHIYAMA YUTO (JP)
TAKUMA TORU (JP)
Application Number:
PCT/JP2022/024140
Publication Date:
January 12, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| WO2020136810A1 | 2020-07-02 | |||
| WO2020012958A1 | 2020-01-16 |
Foreign References:
| JP2014179541A | 2014-09-25 | |||
| JP2017147433A | 2017-08-24 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
Download PDF:
Previous Patent: BALL SCREW DEVICE
Next Patent: COMPOUND, PIGMENT, INK SHEET FOR THERMOSENSITIVE TRANSFER RECORDING
Next Patent: COMPOUND, PIGMENT, INK SHEET FOR THERMOSENSITIVE TRANSFER RECORDING