Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048371
Kind Code:
A1
Abstract:
This semiconductor device constituting an upper-lower arm circuit for one phase comprises joint portions (80, 81) connected through a solder (104). Each of a plurality of solders electrically connected to the main electrode of a semiconductor element contains Cu and Sn. Each solder connection target has a Ni layer. The solder (104) contains Cu and Sn, and the joint portions (80, 81) have Ni layers (801, 811). The particle size of the solder (104) is smaller than the particle size of the solder for connecting the collector electrode.
Inventors:
KAWANO MITSUKI (JP)
KATO NOBUYUKI (JP)
KATO NOBUYUKI (JP)
Application Number:
PCT/JP2023/030170
Publication Date:
March 07, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; B23K1/00; B23K1/14; H01L25/18; H02M7/48
Domestic Patent References:
| WO2012115268A1 | 2012-08-30 | |||
| WO2021085216A1 | 2021-05-06 |
Foreign References:
| JP2016092166A | 2016-05-23 | |||
| JP2014082526A | 2014-05-08 | |||
| JP2021145081A | 2021-09-24 |
Attorney, Agent or Firm:
YAHAGI Kazuyuki et al. (JP)
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